The rapid growth of connected devices (expected to exceed 30 billion by 2030) is reshaping how we collect and process information from the physical world. Devices ranging from smartphones and wearables to industrial sensors and microcontrollers are continuously generating vast amounts of data. Meanwhile, advanced wireless technologies such as 5G, Wi-Fi 6/7, and LPWAN are making it possible to connect a wide range of devices across large and diverse environments.
In this setting, emerging approaches like Distributed, Federated, and Edge Learning are gaining momentum. These methods bring intelligence closer to the data, reducing communication overhead, enabling faster decisions, improving privacy, and supporting energy-efficient processing. Such techniques are particularly relevant in IoT infrastructures that blend local sensing, computation, and actuation, encompassing not only traditional deployments but also edge-cloud infrastructures, cyber-physical systems, and collaborative networks of autonomous agents.
At the same time, integrating Distributed Learning into these environments introduces several open challenges. These include compressing models for transmission over constrained or unreliable networks, managing limited and heterogeneous resources at the edge, accelerating training under dynamic conditions, and ensuring security and privacy when data remains locally distributed.
The Third International Workshop on the Integration between Distributed Machine Learning and the Internet of Things (AIoT) serves as a venue for researchers and practitioners exploring how Distributed and Federated Learning can be applied in real-world, resource-constrained, and large-scale IoT networks. Topics span a wide range of connected setups, where decentralized intelligence plays a key role in enabling robust, adaptive, and efficient operations.
Specifically, the workshop broadly welcomes contributions spanning on-device intelligence, TinyML, Distributed/Federated/Split Learning, communication-efficient AI, and adaptive edge intelligence for heterogeneous IoT environments.
Topics of interest include, but are not limited to:
We welcome both theoretical contributions and applied work, including case studies and practical deployments. Our aim is to bring together a diverse community of experts working at the intersection of Machine Learning, networking, systems, and connected intelligence.
Paper submission: August 31, 2026 (11:59pm EDT)
Acceptance notification: September 23, 2026
Camera ready paper: September 30, 2026 (11:59pm EDT)
Papers should be submitted via the HotCRP submission website: TBD.
Submissions must be original, unpublished work, and not currently under consideration elsewhere. Papers should not exceed 6 pages (US letter size) double column including figures, tables, and references in standard ACM format. Papers must be submitted electronically in printable PDF form. Templates for the standard ACM format can be found at this link: http://www.acm.org/publications/article-templates/proceedings-template.html.
If you are using LaTeX, please refer to the sample file sample-sigconf.tex after you download the .zip templates file and unzip it. Note that the document class \documentclass[sigconf]{acmart} should be used. No changes to margins, spacing, or font sizes are allowed from those specified by the style files. Papers violating the formatting guidelines will be returned without review.
All submissions will be reviewed using a single-blind review process. The identity of referees will not be revealed to authors, but authors can keep their names on the submitted papers, on figures, bibliography, etc.
Accepted papers will appear in the conference proceedings published by the ACM.
Warning: It is ACM policy not to allow double submissions, where the same paper is submitted to more than one conference/journal concurrently. Any double submissions detected will be immediately rejected from all conferences/journals involved.
TBD